Topic: Measuring

Determine the dimensions of a part by means of a measuring device.
Measuring

Enhanced Statistical Process Control applied to AM by Hexagon SPC for AM

Conventional Statistical Process Control (SPC) alone is likely to fall short for AM applications. By combining Non Destructive Testing (NDT) data, metrology data, process data, and simulation data, we are able to perform a root cause analysis.

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Presentation and poster will be available at 17 april 2025

Measuring

White Light Interferometry for Highest Precision 3D-Structure Measurements by Mitutoyo Nederland BV

White Light Interferometry (WLI) uses the interference signal of a broadband light source for highest accuracy, non-contact 3D measurements like for profile or roughness measurements down to a nanometer scale. With new developed WLI objective lenses, the common technology of WLI is driven to its edge.

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Presentation and poster will be available at 17 april 2025

Measuring

Computed tomography (CT) for quality inspection by TPW Prüfzentrum GmbH

CT is a non-destructive inspection technique that allows to examine material quality and geometry for a wide range of samples.

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Presentation and poster will be available at 17 april 2025

Measuring

Computed Tomography: Complete and accurate measurement inside and outside by Werth Messtechnik GmbH

X-ray images of the workpiece are taken at various rotated positions. They can be used to calculate a complete, high-resolution volumetric model.

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Presentation and poster will be available at 17 april 2025

Measuring

Non destructive testing using Impulse Excitation Technique by GrindoSonic BV

a System of non-destructive testing of AM printed or manufactured parts. Using Impulse Excitation Technique to excite tested parts and obtain measurements of porosity, dissipative micro-cracks, asymmetry, damping and key mechanical characteristics (Young, Sheer moduli, Poisson's ratio). Done in a few seconds and no part is destructed.

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Presentation and poster will be available at 17 april 2025

Measuring

Model-based product definition (MBD) combines design & measurement technology. by ZEISS Group

Previously, an inspection plan was created from a CAD model in combination with a 2D technical drawing. The user had to interpret the 2D drawing and transfer the information to the ZEISS CALYPSO measurement plan with the 3D model.

Programming takes less time
Highly digital and automated process
Increased first article inspection
Use common digital methods
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Presentation and poster will be available at 17 april 2025

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17 april 2025
NH Conference Centre Koningshof, Locht 117, 5504 RM Veldhoven

The aim of the Manufacturing Technology Conference is to bring together technicians from the design and manufacturing industry to share knowledge about manufacturability. With this annual Manufacturing Technology Conference, we increase knowledge about manufacturability for developers and help them look for possibilities that were previously unknown.

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