Topic: Removal processes

Material Removal Process is a manufacturing process in which the final product is obtained by removing metal from the starting material.
Removal processes

ULTRASONIC GRINDING OF HARD-BRITTLE ADVANCED MATERIALS by DMG MORI Ultrasonic

DMG MORI Ultrasonic Lasertec GmbH supplies ULTRASONIC machines for optics/ semiconductor, aerospace, dental/ medical technology, the automotive/ and electronics industries.

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Presentation and poster will be available at 17 april 2025

Removal processes

GROB-NET⁴INDUSTRY by GROB-NET⁴Industry

From planning to engineering to maintenance, GROB-NET4Industry combines relevant modules for increasing productivity and offers you the all-round package for modern production in the Industry 4.0.

Visualization of machine states
Dynamic display in various formats
NC, tool, override
Machine/shift comparison
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Presentation and poster will be available at 17 april 2025

Removal processes

Ultraprecise Metaloptics, Mechanics and Mechatronics by KUGLER GmbH – Ultra Precise

Combining milling, turning and grinding, on the most ultra precise machines worldwide: - optical surfaces for laser beam guidance with roughness of < 2nm Ra - mechanical parts with form and lay tolerances in micron and sub micron range - mechatronical parts with optical features

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Presentation and poster will be available at 17 april 2025

Removal processes, Technical Means

Next generation metalworking fluid for clean machining by KSM

The technology is proven to be effective for milling Aluminium, Titanium, Steel and other alloy types. Working with Aquaslide offers significant process improvements with regards to cleaning efforts and production throughput time.

Significant reduction of needed cleaning
No post-production external cleaning
No hydrocarbons or HIO-elements
Label free fluids
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Presentation and poster will be available at 17 april 2025

Removal processes

Comply with GSA surface cleanliness requirements: how to reach ASML grade 1 / grade 2 requirements after wire EDM by Ter Hoek Vonkerosie Wire EDM

Gate Oxide Integrity (GOI) is crucial, as its degradation can disrupt transistor function. ASML systems require strict measures to prevent GOI-degrading contaminants from reaching the wafer. Grade 2 standards ensure parts and modules are free of Cu, Ag, and Au, essential for preventing cross-contamination.

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Presentation and poster will be available at 17 april 2025

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17 april 2025
NH Conference Centre Koningshof, Locht 117, 5504 RM Veldhoven

The aim of the Manufacturing Technology Conference is to bring together technicians from the design and manufacturing industry to share knowledge about manufacturability. With this annual Manufacturing Technology Conference, we increase knowledge about manufacturability for developers and help them look for possibilities that were previously unknown.

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